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GJM and SPEA Formally Signed a Strategic Cooperation Agreement

2023.06.30

On June 28, GJM and SPEA formally signed a strategic cooperation agreement in Taicang Production Base. Both parties will give full play to their respective advantages in the industry and strengthen the development of their MEMS testing and calibration business in Chinese mainland.

Roberto. Sannicandro, Chief Financial Officer, Emanuele Bardo, Executive Vice President, Sun Yuanli, General Manager of Chinese Zone from SPEA, Tang Funan, Co-founder of Shenzhen T&W Electronics and Chairman of GJM, Hu Zumin, General Manager of Shenzhen T&W, Zhuge Zhong, Executive Director of Probe Perception Fund, and Zhang Wenyan, General Manager of GJM attended the signing ceremony.

According to the agreement, SPEA will provide GJM with high-quality electronic automatic test equipment, and provide professional packaging test services and technical support. This cooperation will help promote the development of GJM in the field of closed beta test, and further expand and develop the commercial layout of wafer testing of MEMS sensors and actuators and calibration of packaging equipment. At the same time, GJM will also become the designated buyer and distributor of SPEA equipment in China, providing strong support for SPEA's expansion in the Chinese market.
 
The signing of this strategic cooperation signing agreement marks an important step for GJM and SPEA to carry out in-depth cooperation in the field of packaging test. We firmly believe that through joint efforts, both parties will develop more broad market opportunities, improve the competitive strength of enterprises and make positive contributions to industrial development.
 
Since 1976, SPEA has designed and manufactured the best electronic automated test equipment, such as semiconductor wafers, integrated circuits, MEMS and sensors, circuit boards, power modules, electric vehicles and consumer batteries. SPEA is known as the top supplier of test equipment such as medical equipment, MEMS, battery management system and power electronics.
 
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